Memory

Just shy of a year ago, SK Hynix threw their hat into the ring, as it were, by becoming the second company to announce memory based on the HBM2E standard. Now the company has announced that their improved high-speed, high density memory has gone into mass production, offering transfer rates up to 3.6 Gbps/pin, and capacities of up to 16GB per stack. As a quick refresher, HBM2E is a small update to the HBM2 standard to improve its performance, serving as a mid-generational kicker of sorts to allow for higher clockspeeds, higher densities (up to 24GB with 12 layers), and the underlying changes that are required to make those happen. Samsung was the first memory vendor to ship HBM2E with their 16GB/stack Flashbolt memory, which...

GeIL Unveils Orion Series Memory, Up to DDR4-4000 with 32 GB Memory Modules

GeIL has announced its newest family of DDR4 modules, the Orion series. Available in two versions, one standard and one for AMD platforms, the Orion series offers SKUs ranging...

6 by Gavin Bonshor on 6/11/2020

Patriot's New 32GB Modules Available: UDIMM up to DDR4-3600, SODIMM up to DDR4-3000

Patriot has released a new series of DDR4 32GB memory modules in its VIPER GAMING STEEL series, complementing the 32GB offerings of the Blackout series as well as for...

11 by Andrei Frumusanu on 6/9/2020

New ZADAK Twist DDR4 Memory, Up to DDR4-4133 and 256 GB

ZADAK has announced its latest range of DDR4 memory, the Twist series. Designed for users looking for a lower profile alternative to its previous memory brands, the Twist features...

7 by Gavin Bonshor on 5/6/2020

GeiL Unveils 64 GB DDR4-3200 SO-DIMM Kit, 2 x 32 GB

Memory manufacturer Golden Emporer International Limited, or known generally as GeiL, has announced its new memory line with support for Intel 10th Gen and AMD Ryzen 4000 series processors...

21 by Gavin Bonshor on 5/5/2020

XPG Spectrix D50 Memory: A More Subtle RGB DDR4

ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go...

22 by Gavin Bonshor on 4/15/2020

ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile

ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both...

41 by Gavin Bonshor on 4/15/2020

China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb

Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its...

64 by Gavin Bonshor on 4/13/2020

SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts

Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...

86 by Gavin Bonshor on 4/3/2020

Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter

As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...

12 by Anton Shilov on 4/1/2020

Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development

JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...

20 by Anton Shilov on 3/27/2020

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules

One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...

8 by Gavin Bonshor on 3/27/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

GlobalFoundries & Everspin Extend MRAM Pact to 12nm

GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...

5 by Anton Shilov on 3/13/2020

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus

The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...

41 by Anton Shilov on 3/6/2020

ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel

ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...

7 by Anton Shilov on 3/5/2020

Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones

Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...

32 by Anton Shilov on 2/25/2020

SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments

SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...

7 by Anton Shilov on 2/14/2020

G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit

The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...

8 by Anton Shilov on 2/12/2020

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

9 by Anton Shilov on 2/11/2020

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