Memory

ZADAK has announced its latest range of DDR4 memory, the Twist series. Designed for users looking for a lower profile alternative to its previous memory brands, the Twist features aluminium heatsinks and is available in 8 GB to 32 GB modules with speeds of up to DDR4-4133, including a 256 GB of DDR4-4133. With a black and silver-finished aluminium heatsinks, ZADAK keeps up in the style stakes with its new Twist series. The heatsink measures in at 1.38 inches in height, which is lower profile than the vast majority of ZADAK's current range, but cannot officially considered to be low profile in terms of specification. The heatsinks themselves are constructed from anodized aluminium without RGB LED lighting and are backed by ZADAK's limited lifetime warranty. Available...

G.Skill Unveils Trident Z Royal Hexa-Channel 192 GB DDR4-4000 Kit for Xeon W-3175X

G.Skill has released the industry’s first hexa-channel DDR4 memory kits designed specifically for Intel’s 28-core Xeon W-3175X processor for extreme workstations. The top-of-the-range kit features a 192 GB capacity...

15 by Anton Shilov on 1/30/2019

GIGABYTE Adds Support for 128 GB of Memory to Z390 & C246 Motherboards

GIGABYTE has released UEFI BIOS updates for its motherboards based on Intel’s C246 and Z390 chipsets that enable support for 32 GB unbuffered memory modules from Samsung. This enables...

9 by Anton Shilov on 1/24/2019

Double Height DDR4: 32GB Modules from G.Skill and ZADAK Reviewed

Two memory module companies, G.Skill and ZADAK, have developed a new memory format with double capacity DDR4 memory. These new modules put the equivalent of two standard modules onto...

52 by Ian Cutress & Gavin Bonshor on 1/23/2019

ASUS Z390 Platforms Now Support 128 GB of Memory

ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...

8 by Anton Shilov on 1/22/2019

CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs

GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...

3 by Anton Shilov on 1/14/2019

CES 2019: ADATA Spectrix Memory & SSDs Get More RGB

RGB lighting has become a major selling point for hardware aimed at gamers and performance enthusiasts. After all, since modern CPUs, GPUs, DRAMs, SSDs, and other components offer plenty...

4 by Anton Shilov on 1/14/2019

CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD

One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...

5 by Gavin Bonshor on 1/10/2019

CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory

At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...

13 by Gavin Bonshor on 1/9/2019

JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack

JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...

15 by Anton Shilov on 12/19/2018

Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86

It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...

149 by Ian Cutress on 12/12/2018

Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems

Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...

5 by Anton Shilov on 11/26/2018

Cadence Tapes Out GDDR6 IP on Samsung 7LPP Using EUV

Cadence has announced that it has successfully taped out its GDDR6 IP on Samsung’s 7LPP fabrication process. The new building blocks should enable developers of various chips to be...

11 by Anton Shilov on 11/26/2018

Your Highness: G.Skill Trident Z Royal, Bling Factor 11

G.Skill this week has officially introduced its Trident Z Royal family of memory modules. This memory featuring crystalline light bars with RGB lighting and polished heat spreaders. The modules...

4 by Anton Shilov on 11/20/2018

SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking

SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...

4 by Anton Shilov on 11/16/2018

SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM

SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...

29 by Anton Shilov on 11/15/2018

G.Skill Unveils 64 GB DDR4-4266 and 128 GB DDR4-4000 Kits for HEDTs

Coinciding with today’s launch of Intel’s HEDT “Skylake-X/Basin Falls Refresh” family of CPUs, G.Skill today announced its new 64 GB DDR4-4266 and 128 GB DDR4-4000 kits designed for high-end...

1 by Anton Shilov on 11/13/2018

In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK

One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...

19 by Ian Cutress on 11/9/2018

SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans

SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...

4 by Anton Shilov on 11/8/2018

Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips

Micron this week announced that it had started mass production of its first LPDDR4X memory devices using its second-generation 10 nm-class process technology. The new memory devices offer standard...

10 by Anton Shilov on 11/8/2018

U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm

The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...

58 by Anton Shilov on 11/1/2018

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