Memory

ZADAK has announced its latest range of DDR4 memory, the Twist series. Designed for users looking for a lower profile alternative to its previous memory brands, the Twist features aluminium heatsinks and is available in 8 GB to 32 GB modules with speeds of up to DDR4-4133, including a 256 GB of DDR4-4133. With a black and silver-finished aluminium heatsinks, ZADAK keeps up in the style stakes with its new Twist series. The heatsink measures in at 1.38 inches in height, which is lower profile than the vast majority of ZADAK's current range, but cannot officially considered to be low profile in terms of specification. The heatsinks themselves are constructed from anodized aluminium without RGB LED lighting and are backed by ZADAK's limited lifetime warranty. Available...

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

6 by Anton Shilov on 10/22/2019

Team Group Quietly Launches 32 GB DDR4 Memory Modules

Team Group has quietly added 32 GB unbuffered DDR4 memory modules to its product catalogue and plans to start sales in the near future. The modules will feature JEDEC-standard...

8 by Anton Shilov on 10/22/2019

Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel

Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...

14 by Anton Shilov on 10/21/2019

Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI

The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...

38 by Anton Shilov on 10/11/2019

G.Skill Launches 32 GB DDR4 Modules, 256 GB Kits: Up to DDR4-4000

G.Skill has now rolled out its 32 GB unbuffered DDR4 modules in dual-channel and quad-channel memory kits. The modules are offered with data transfer rates from 2666 MT/s to...

27 by Anton Shilov on 10/9/2019

Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2

Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...

11 by Anton Shilov on 10/7/2019

Gen-Z PHY Specification 1.1 Published: Adds PCIe 5.0, Gen-Z 50G Fabric

The Gen-Z Consortium this week released Physical Layer Specification 1.1 for Gen-Z interconnects. The new standard adds enhanced support for PCIe Gen 5 as well as Gen-Z 50G Fabric...

8 by Anton Shilov on 10/4/2019

Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon

Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...

10 by Anton Shilov on 10/4/2019

Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit

Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...

12 by Anton Shilov on 9/13/2019

YMTC Starts Volume Production of 64-Layer 3D NAND

Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...

3 by Anton Shilov on 9/5/2019

Hot Chips 31 Analysis: In-Memory Processing by UPMEM

One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...

37 by Dr. Ian Cutress on 8/19/2019

Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019

Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...

21 by Anton Shilov on 8/16/2019

Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology

Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...

25 by Anton Shilov on 8/16/2019

SMART Modular Shows Off 256 GB Gen-Z Memory Module

SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...

16 by Anton Shilov on 8/15/2019

SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators

SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...

23 by Ryan Smith on 8/12/2019

Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea

Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...

16 by Anton Shilov on 8/9/2019

Microchip Announces DRAM Controller For OpenCAPI Memory Interface

Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...

17 by Billy Tallis on 8/5/2019

Western Digital: Nearly All NAND Capacities Resumed Normal Operations

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...

31 by Anton Shilov on 8/1/2019

G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000

G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14...

10 by Anton Shilov on 8/1/2019

Thermaltake’s Launches Liquid-Cooled WaterRam RGB DDR4-3600 Kits

Seemingly intent on proving that everything in a PC should in fact be liquid cooled, Thermaltake this week has expanded its WaterRAM lineup of water-cooled RAM with DDR4-3600 kits. Available...

18 by Anton Shilov on 8/1/2019

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