Memory

Just shy of a year ago, SK Hynix threw their hat into the ring, as it were, by becoming the second company to announce memory based on the HBM2E standard. Now the company has announced that their improved high-speed, high density memory has gone into mass production, offering transfer rates up to 3.6 Gbps/pin, and capacities of up to 16GB per stack. As a quick refresher, HBM2E is a small update to the HBM2 standard to improve its performance, serving as a mid-generational kicker of sorts to allow for higher clockspeeds, higher densities (up to 24GB with 12 layers), and the underlying changes that are required to make those happen. Samsung was the first memory vendor to ship HBM2E with their 16GB/stack Flashbolt memory, which...

Flash Memory Summit, Western Digital Keynote Live Blog

Second Keynote for us: Western Digital

0 by Ian Cutress & Billy Tallis on 8/7/2018

MRAM Developer Day, IBM Keynote Live Blog

Third Keynote in this session is from IBM Research: STT-MRAM is Ready for Applications Today.

0 by Ian Cutress on 8/6/2018

MRAM Developer Day, GlobalFoundries Keynote Live Blog

Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.

1 by Ian Cutress on 8/6/2018

MRAM Developer Day, Everspin Keynote: The MRAM Revolution (9:15am PT, 4:15pm UTC)

Prior to Flash Memory Summit, the first order of business is the MRAM Developer Day. The key talks today revolve around Everspin, a leader in MRAM Technology, GlobalFoundries, and...

3 by Ian Cutress & Billy Tallis on 8/6/2018

Yangtze Memory Unveils Xtacking Architecture for 3D NAND: Up to 3 Gbps I/O

Yangtze Memory Technologies Co. (YMTC) on Monday unveiled key details regarding its Xtacking architecture that will be used for its upcoming 3D NAND flash memory chips. The company's technology...

7 by Anton Shilov on 8/6/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Samsung Starts Production of 16 Gb LPDDR4X Chips Using 2nd Gen 10nm Tech

Samsung this week announced that it has begun manufacturing its new LPDDR4X memory chips using its second-generation 10 nm-class fabrication process (which is traditionally called 1y nm). The new...

12 by Anton Shilov on 7/27/2018

Toshiba Begins to Construct New BiCS 3D NAND Fab in Iwate Prefecture

Toshiba Memory Corp. this week held a groundbreaking ceremony for its new BiCS 3D NAND flash memory fab, which is located in Japan's Iwate prefecture. Toshiba anticipates construction to...

5 by Anton Shilov on 7/25/2018

Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND

Western Digital has started sampling its 96-layer 3D NAND chips featuring QLC architecture that stores four bits per cell. The chip happens to be the world’s highest-capacity 3D NAND...

40 by Anton Shilov on 7/20/2018

Samsung Announces First LPDDR5 DRAM Chip, Targets 6.4Gbps Data Rates & 30% Reduced Power

Samsung has been on a roll lately with memory & storage-related announcements, and that roll is continuing today with a new DRAM-related announcement out of the juggernaut. This afternoon...

13 by Ryan Smith on 7/16/2018

Intel and Micron To Dissolve 3D XPoint Partnership After 2019

A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class...

19 by Ian Cutress on 7/16/2018

Zen and Vega DDR4 Memory Scaling on AMD's APUs

We have previously explored the importance of memory scaling within AMDs Ryzen CPUs: the question being answered today is how much of an effect on performance does the memory...

74 by Gavin Bonshor on 6/28/2018

Micron Begins Mass Production of GDDR6

This morning Micron is announcing that they’ve kicked off production of their next-generation GDDR6 memory. This next step in production comes on the heels of their internal qualification, which...

29 by Ryan Smith on 6/25/2018

Colorful to Branch Out to Memory Modules

One of the surprises that this year’s Computex brought was renewed interest of various hardware suppliers towards memory modules. We saw GIGABYTE and Antec launching their Aorus and Antec...

5 by Anton Shilov on 6/22/2018

G.Skill Trident Royal Crystalline DRAM: Premium Gemstone Glamour

Despite virtually everything in the consumer world being unnecessarily stuffed to the gills with RGB LEDs, they seem to sell like hotcakes. I was told earlier this year by...

30 by Ian Cutress on 6/14/2018

Building for Apache Pass: Why Some Skylake Servers Already have 8 DIMMs Per Socket

If you don’t have a hand in a server day in and day out, it was perhaps not obvious why some Skylake servers when launched had eight memory slots...

16 by Ian Cutress on 6/13/2018

Antec Announces Its First Memory Modules

In a rather unexpected move, Antec announced its first memory modules at Computex. The Antec Memory DDR4 DIMMs are meant to stretch Antec’s designs to DIMMs, increasing the company’s...

10 by Anton Shilov on 6/12/2018

Samsung Kicks Off Mass Production of 64GB RDIMMs Using 16Gbit Chips

Back in March, Samsung first demonstrated their next-generation 64GB DDR4 Registered DIMMs. Based on Samsung’s new 16Gbit DDR4 memory chips, these new RDIMMs would offer 64GB of memory capacity...

7 by Ryan Smith on 6/11/2018

G.Skill’s DRAM Extremes: DDR4-4000 on AMD Ryzen, DDR4-5066 on Intel Core i7

In the constant race to one-up the other memory vendors in the highly commoditized DRAM market, at Computex last week G.Skill demonstrated its Trident Z RGB memory modules running...

18 by Anton Shilov on 6/11/2018

Klevv Adds Kolors: RGB-Lit Enthusiast-Class Cras DIMMs & SSD Incoming

Klevv, a subsidiary of SK Hynix, has been around for quite a while targeting mass retail market with mainstream DRAM and SSD products. Recently Klevv decided to address the...

13 by Anton Shilov on 6/7/2018

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