One of the prominent parts of Intel’s announcement this week for the new 9th Generation core processors was that both the overclockable consumer processors and the new high-end desktop processors all feature a soldered thermal interface material (STIM) between the silicon die and the heatspreader. This is a vast improvement over the previous thermal interface material due to the solder's superior ability to conduct thermal energy away from the silicon die. As part of the announcement, Intel also engaged in some extreme overclocking at its launch event using Liquid Nitrogen as an effective coolant, and some overclocking world champions.
ASRock Announces the X299 OC Formula Motherboard
Back in May of this year, we saw our first glimpse of the X299 OC Formula, ASRock’s to-be high-end overclocking focused motherboard. In the past couple of generations, the...13 by Joe Shields on 9/11/2017
Computex 2014: GIGABYTE’s Liquid Nitrogen Memory Overclocking Motherboard, Z97X-SOC Force LN2
Taking a track day car to an event for regular road vehicles seems a bit unfair from the point of view of the regular drivers, however in order to...7 by Ian Cutress on 6/4/2014