CPUs
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
Intel Announces Non-K 13th Gen Core For Desktop: New 65 W and 35 W Processors
When Intel launches a new family of desktop processors, it typically unleashes its high-end unlocked SKUs first, including the K and KF models. Not only does this give users...
28 by Gavin Bonshor on 1/3/2023
Intel Reports Q3 2022 Earnings: Back To Profitability, But Still Painful
While always an interesting topic by default, corporate earnings reports in the tech industry have become especially important in the last few months, as the industry prepares to weather...
16 by Ryan Smith on 10/27/2022
Intel Core i9-13900K and i5-13600K Review: Raptor Lake Brings More Bite
Today marks the release of Intel’s 13th Gen Core series, codenamed Raptor Lake. The first models to be unleashed into retail channels are all overclockable parts, with six SKUs...
169 by Gavin Bonshor on 10/20/2022
AMD Issues Early Q3’22 Financial Results: Misses Guidance By $1B as Client Revenue Craters
Underscoring a difficult second half of the year that seems to be shaping up for the entire tech industry, AMD this afternoon has become the latest tech company to...
33 by Ryan Smith on 10/6/2022
Intel Demos Sapphire Rapids Hardware Accelerator Blocks In Action At Innovation 2022
With Intel’s annual Innovation event taking place this week in San Jose, the company is looking to recapture a lot of technical momentum that has slowly been lost over...
42 by Ryan Smith on 9/28/2022
Intel Innovation 2022 Keynote: Live Blog (9am PT, 4pm UTC)
It's time again for another Intel event, Intel Innovation 2022. With plenty of tech things to reveal to the world ranging from AI, client computing, and data center/cloud computing...
23 by Gavin Bonshor & Ryan Smith on 9/27/2022
AMD Zen 4 Ryzen 9 7950X and Ryzen 5 7600X Review: Retaking The High-End
During AMD’s ‘together we advance_PCs’ event at the end of August, the company unveiled its Ryzen 7000 series of desktop processors, with four SKUs aimed at the mid-range and...
206 by Ryan Smith & Gavin Bonshor on 9/26/2022
AMD Launches Mendocino APUs: Zen 2-based Ryzen and Athlon 7020 Series with RDNA 2 Graphics
Even though the main focus this month has been on AMD's upcoming launch of its Ryzen 7000 desktop series processors based on the Zen 4 architecture, AMD is also...
50 by Gavin Bonshor on 9/20/2022
Intel to Drop Celeron and Pentium Branding From Laptop Parts In 2023
While we’re still over a quarter out from the end of 2022, Intel already has its eyes aimed at 2023 and its eventual refresh of its mobile processors. To...
29 by Ryan Smith on 9/16/2022
Arm Announces Neoverse V2 and E2: The Next Generation of Arm Server CPU Cores
Just under four years ago, Arm announced their Neoverse family of infrastructure CPU designs. Deciding to double-down on the server and edge computing markets by designing Arm CPU cores...
39 by Ryan Smith on 9/15/2022
AMD Updates Ryzen Mobile CPU Numbering System Ahead of Mendocino APU Launch
While all eyes are on the impending launch of AMD’s new Ryzen 7000 desktop processors, the chipmaker also has its wheels in motion for the future of its mobile...
28 by Ryan Smith on 9/7/2022
AMD Details Ryzen 7000 Launch: Ryzen 7950X and More, Coming Sept. 27th
AMD’s "together we advance_PCs”l ivestream presentation just wrapped up moments ago, where AMD CEO Dr. Lisa Su set the stage for the release of the next generation of AMD...
106 by Ryan Smith on 8/29/2022
AMD Ryzen 7000 "together we advance_PCs” Live Blog (7pm ET/23:00 UTC)
At long last the date is here. AMD this evening will be broadcasting their "together we advance_PCs” event, which will be focused around the upcoming launch of their next-generation...
45 by Gavin Bonshor on 8/29/2022
AMD Announces Ryzen 7000 Reveal Livestream for August 29th
In a brief press release sent out this morning, AMD has announced that they will be delivering their eagerly anticipated Ryzen 7000 unveiling later this month as a live...
52 by Ryan Smith on 8/16/2022
UCIe Consortium Incorporates, Adds NVIDIA and Alibaba As Members
Among the groups with a presence at this year’s Flash Memory Summit is the UCIe Consortium, the recently formed group responsible for the Universal Chiplet Interconnect Express (UCIe) standard...
21 by Ryan Smith on 8/4/2022
Compute Express Link (CXL) 3.0 Announced: Doubled Speeds and Flexible Fabrics
While it’s technically still the new kid on the block, the Compute Express Link (CXL) standard for host-to-device connectivity has quickly taken hold in the server market. Designed to...
4 by Ryan Smith on 8/2/2022
OpenCAPI to Fold into CXL - CXL Set to Become Dominant CPU Interconnect Standard
With the 2022 Flash Memory Summit taking place this week, not only is there a slew of solid-state storage announcements in the pipe over the coming days, but the...
8 by Ryan Smith on 8/1/2022
The Intel Core i9-12900KS Review: The Best of Intel's Alder Lake, and the Hottest
As far as top-tier CPU SKUs go, Intel's Core i9-12900KS processor sits in noticeably sharp In contrast to the launch of AMD's Ryzen 7 5800X3D processor with 96 MB...
57 by Gavin Bonshor on 7/29/2022
The AMD Ryzen 7 5800X3D Review: 96 MB of L3 3D V-Cache Designed For Gamers
The level of competition in the desktop CPU market has rarely been as intensive as it has been over the last couple of years. When AMD brought its Ryzen...
125 by Gavin Bonshor on 6/30/2022
Samsung Starts 3nm Production: The Gate-All-Around (GAAFET) Era Begins
Capping off a multi-year development process, Samsung’s foundry group sends word this morning that the company has officially kicked off production on its initial 3nm chip production line. Samsung’s...
22 by Ryan Smith on 6/30/2022
Facebook
Twitter
RSS
