Semiconductors

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter. The company says that in increase in demand for HPC processors (which includes processors for AI, PCs, and servers) drove its revenue rebound in Q1, but surprisingly, revenue share of TSMC's flagship N3 (3nm-class) process technology declined steeply quarter-over-quarter. "Our business in the first quarter was impacted by smartphone seasonality, partially offset by continued HPC-related demand," said Wendell Huang, senior VP and chief financial officer of TSMC. "Moving into second quarter 2024, we expect our business to be supported by strong demand for...

ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...

13 by Anton Shilov 3 days ago

Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...

5 by Anton Shilov 5 days ago

TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona

TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...

19 by Anton Shilov on 4/8/2024

Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies

Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...

10 by Anton Shilov on 4/2/2024

Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace

When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster...

8 by Anton Shilov on 3/23/2024

Intel to Receive $8.5B in CHIPS Act Funding & Further Loans To Build US Fabs

Intel and the United States Department of Commerce announced on Wednesday that they had inked a preliminary agreement under which Intel will receive $8.5 billion in direct funding under...

20 by Anton Shilov on 3/20/2024

NVIDIA's 'cuLitho' Computational Lithography Adopted By TSMC and Synopsys For Production Use

Last year, NVIDIA introduced its cuLitho software library, which promises to speed up photomask development by up to 40 times. Today, NVIDIA announced a partnership with TSMC and Synopsys...

21 by Anton Shilov on 3/18/2024

ASML Delivers First 2nm-Generation Low-NA EUV Tool, the Twinscan NXE:3800E

Our avid readers tend to look at microelectronics made using leading edge process technologies, which in case of Intel means usage of High-NA extreme ultraviolet (EUV) lithography a couple...

2 by Anton Shilov on 3/13/2024

Marvell's 2nm IP Platform Enables Custom Silicon for Datacenters

Marvell this week introduced its new IP technology platform specifically tailored for custom chips for accelerated infrastructure made on TSMC's 2nm-class process technologies (possibly including N2 and N2P). The...

0 by Anton Shilov on 3/8/2024

Intel to Hold Webinar to Discuss Long-Term Vision for Foundry, Separating Fab and Design Reporting

As Intel prepares to move its fabs into its new Intel Foundry business, it will change the way it reports results in the coming months. To discuss the company's...

1 by Anton Shilov on 3/7/2024

Arm and Samsung to Co-Develop 2nm GAA-Optimized Cortex Cores

Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA...

3 by Anton Shilov on 2/22/2024

IFS Reborn as Intel Foundry: Expanded Foundry Business Adds 14A Process To Roadmap

5 nodes in 4 years. This is what Intel CEO Pat Gelsinger promised Intel’s customers, investors, and the world at large back in 2021, when he laid out Intel’s...

29 by Ryan Smith on 2/21/2024

GlobalFoundries to Receive $1.5 Billion In Funding from U.S. CHIPS Act

The United States Department of Commerce and GlobalFoundires announced on Monday that the US will be awarding GlobalFoundries with $1.5 billion in funding under the CHIPS and Science Act...

5 by Anton Shilov on 2/20/2024

GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected

When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to...

26 by Anton Shilov on 2/14/2024

ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...

8 by Anton Shilov on 2/14/2024

Global Semiconductor Sales Hit $526.8 Billion in 2023

The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a...

13 by Anton Shilov on 2/9/2024

TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan

Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...

4 by Anton Shilov on 2/6/2024

Intel Teams Up with UMC for 12nm Fab Node at IFS

Intel and UMC on Thursday said they had entered into an agreement to jointly to develop a 12 nm photolithography process for high-growth markets such as mobile, communication infrastructure...

12 by Anton Shilov on 1/25/2024

Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations

Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9...

2 by Anton Shilov on 1/25/2024

Log in

Don't have an account? Sign up now