There's been a lot of focus on how both Intel and AMD are planning for the future in packaging their dies to increase overall performance and mitigate higher manufacturing costs. For AMD, that next step has been V-cache, an additional L3 cache (SRAM) chiplet that's designed to be 3D die stacked on top of an existing Zen 3 chiplet, tripling the total about of L3 cache available. Now AMD's V-cache technology is finally becoming available to the mass market, as AMD's EPYC 7003X "Milan-X" server CPUs have now reached general availability. As first announced late last year, AMD is bringing its 3D V-Cache technology to the enterprise market through Milan-X, an advanced variant of its current-generation 3rd Gen Milan-based EPYC 7003 processors. AMD is launching...
Back in March, we reviewed AMD's latest Zen 3 based EPYC 7003 processors, including the 64-core EPYC 7763 and 7713. We've updated the data back in June with a...29 by Gavin Bonshor on 8/2/2021
It’s been a few months since AMD first announced their new third generation EPYC Milan server CPU line-up. We had initially reviewed the first SKUS back in March, covering...58 by Andrei Frumusanu on 6/25/2021
During Computex 2021 in Taipei, although the event is all-digital due to the Coronavirus pandemic, GIGABYTE Server has showcased its newly revised MZ72-HBO dual-socket motherboard with support for AMD's...13 by Gavin Bonshor on 6/4/2021
The arrival of AMD’s 3rd Generation EPYC processor family, using the new Zen 3 core, has been hotly anticipated. The promise of a new processor core microarchitecture, updates to...120 by Dr. Ian Cutress & Andrei Frumusanu on 3/15/2021
We’ve known for a while that AMD was set to launch its next generation enterprise EPYC processor family, collectively known by its codename Milan, sometime in the first quarter...18 by Dr. Ian Cutress on 3/8/2021