DRAM
Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32 Gb DDR5 memory devices, which the company announced earlier this summer and which will eventually open doors for 1 TB memory modules for servers. "We expanded our high-capacity D5 DRAM module portfolio with a monolithic die-based 128 GB module, and we have started shipping samples to customers to help support their AI application needs," said Sanjay Mehrotra, president and chief executive of Micron. "We expect revenue from this product in Q2 of calendar 2024." Micron's 32 Gb DDR5 dies are made on the company's 1β (1-beta) manufacturing process, which is the last production node that solely relies...
Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM
Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...
39 by Anton Shilov on 1/13/2020
DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1
Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...
5 by Anton Shilov on 1/9/2020
CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners
Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...
7 by Anton Shilov on 1/7/2020
An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros
I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...
19 by Dr. Ian Cutress on 1/3/2020
Samsung’s Fab in Hwaseong Suffers Power Outage
Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...
48 by Anton Shilov on 1/2/2020
Micron Obtains License to Sell DRAM & NAND to Huawei
The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...
12 by Anton Shilov on 12/19/2019
ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP
ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...
15 by Anton Shilov on 12/2/2019
SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules
SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...
8 by Anton Shilov on 10/22/2019
Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel
Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...
14 by Anton Shilov on 10/21/2019
Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI
The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...
38 by Anton Shilov on 10/11/2019
Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit
Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...
12 by Anton Shilov on 9/13/2019
Hot Chips 31 Live Blogs: Facebook Zion Unified Training Platform
Facebook is presenting details on Zion, its next generation in-memory unified training platform.
0 by Dr. Ian Cutress on 8/19/2019
Hot Chips 31 Analysis: In-Memory Processing by UPMEM
One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...
38 by Dr. Ian Cutress on 8/19/2019
Hot Chips 31 Live Blogs: Intel Optane
This year at Hot Chips, Intel is presenting the latest updates to its Optane PCDMM strategy.
21 by Dr. Ian Cutress on 8/19/2019
Hot Chips 31 Live Blogs: Princeton In-Memory Compute Embedded CPU
Princeton is presenting it's own solution for in-memory compute this year at Hot Chips.
3 by Dr. Ian Cutress on 8/19/2019
Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology
Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...
25 by Anton Shilov on 8/16/2019
SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators
SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...
23 by Ryan Smith on 8/12/2019
Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea
Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...
16 by Anton Shilov on 8/9/2019
Microchip Announces DRAM Controller For OpenCAPI Memory Interface
Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...
17 by Billy Tallis on 8/5/2019
G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000
G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14...
10 by Anton Shilov on 8/1/2019
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