3D NAND

In a brief news release from Intel this afternoon, the chip firm has announced that it has closed on the first stage of its deal to sell its SSD business to SK hynix. As of today, SK hynix has now formally acquired the bulk of Intel’s NAND and SSD businesses, as well as the company’s NAND fab in Dalian, China. Intel will continue to hold a small stake until 2025, and in the meantime Intel’s former SSD assets have been spun-off into a new SK hynix subsidiary, Solidigm. The Intel-SK hynix deal was first announced in October of 2020, with the two companies inking a deal to transfer over Intel’s NAND and SSD operations over to SK hynix over a several year timeframe. The deal...

Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future

One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...

23 by Dr. Ian Cutress on 12/30/2019

Samsung to Expand 3D NAND Fab in China

Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...

5 by Anton Shilov on 12/17/2019

Macronix to Start Shipments of 3D NAND in 2020

Macronix, a Taiwan-based manufacturer for special-purpose memory solutions, will start volume shipments of its own 3D NAND memory in the second half of next year. The company will become...

18 by Anton Shilov on 12/11/2019

NAND Flash Revenue Peaks in Q3 Amid Production Cuts & Outages

Despite cuts in wafer starts by almost all NAND producers, and even disruptions in Kioxia (former Toshiba Memory) and Western Digital's fab operations, analysts estimate that bit shipments of...

10 by Anton Shilov on 12/4/2019

SK Hynix Sampling 128-layer 3D NAND SSDs

SK Hynix announced this week that they have started sampling products based on their 128-layer 3D NAND flash memory, which will soon start showing up in end-user devices. A...

9 by Billy Tallis & Anton Shilov on 11/21/2019

Kioxia Expands Automotive Grade eUFS Lineup: 512 GB for Extreme Conditions

Kioxia (formerly Toshiba Memory), has expanded its lineup of embedded UFS (eUFS) storage with a 512 GB device based on the company’s BiCS 3D NAND flash. The chip is...

5 by Anton Shilov on 11/15/2019

Western Digital Begins Shipments of 96-Layer 3D QLC-Based SSDs, Retail Products

Western Digital announced this week that it has started shipments of its first products based on 3D QLC NAND memory. The initial devices to use the highly-dense flash memory...

28 by Anton Shilov on 11/1/2019

Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon

Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...

10 by Anton Shilov on 10/4/2019

Goke Unveils Toshiba XL-Flash-Based NVMe SSDs: Ultra-Low Latency

Goke Microelectronics has introduced its new NVMe SSDs based on Toshiba’s XL-Flash NAND memory. The new drives are aimed at applications that require an ultra-low latency as well as...

8 by Anton Shilov on 10/2/2019

YMTC Starts Volume Production of 64-Layer 3D NAND

Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...

4 by Anton Shilov on 9/5/2019

Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019

Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...

21 by Anton Shilov on 8/16/2019

Toshiba Launches XL-FLASH 3D SLC NAND

Last year at Flash Memory Summit, Toshiba announced XL-FLASH, a specialized low-latency SLC 3D NAND flash memory that is their answer to Samsung's Z-NAND (and to a lesser extent...

16 by Billy Tallis on 8/5/2019

Western Digital: Nearly All NAND Capacities Resumed Normal Operations

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...

31 by Anton Shilov on 8/1/2019

SK Hynix NAND Update: 3D NAND Output Cut, Slowdown Capacity Expansions

SK Hynix said that it would cut wafer starts of 3D NAND in the coming months more aggressively than it originally anticipated earlier this year. Besides, the company will...

14 by Anton Shilov on 7/26/2019

Western Digital Unveils IntelliFlash N5100: An Entry-Level All-Flash Storage System

Western Digital has introduced its most affordable NVMe all-flash storage array, the new IntelliFlash N5100. The device offers up to 92 TB of raw NAND flash using SN200 NVMe...

17 by Anton Shilov on 7/19/2019

Toshiba & WD NAND Production Hit By Power Outage: 6 Exabytes Lost

Toshiba Memory and Western Digital on Friday disclosed that an unexpected power outage in the Yokkaichi province in Japan on June 15 affected the manufacturing facilities that are jointly...

150 by Anton Shilov on 6/28/2019

Micron: Shipments of 3D QLC for SSDs Nearly Double QoQ as Wafer Starts Cut Again

Micron was among the first companies to start mass production and shipments of 3D QLC NAND, so it is not surprising that at present it is among the leading...

11 by Anton Shilov on 6/28/2019

SK Hynix Launches 2nd Gen Enterprise SSD: 72-Layer 3D NAND & In-House Controller

SK Hynix on Thursday introduced its 2nd generation enterprise-grade NVMe SSDs, which are based entirlely on the company's in-house SSD technology. The new drives offer 4 – 8 TB...

4 by Anton Shilov on 6/21/2019

Phison Readies PS2251-17: A USB 3.2 Gen 2x2 Controller for External SSDs

At this year's Computex trade show, Phison revealed that it is working on a USB 3.2 Gen 2x2 controller for external SSDs. Dubbed the PS2251-17 (U17), the company expects...

8 by Anton Shilov on 6/19/2019

Phison Develops PS5017 Controller for SD Express & MicroSD Express Cards

In order for the SD 7.0/7.1 (aka SD Express) ecosystem to take off, a number of things are needed, but aside from specification itself, availability of controllers for card...

18 by Anton Shilov on 6/14/2019

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