DRAM

Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its ambitious plan to invest $40 billion in its U.S.-based manufacturing capacities by the end of this decade as well as spend $150 billion on new fabs by 2030 globally. Micron's upcoming leading-edge fab will produce DRAM and will be a rather colossal manufacturing facility. At build-out, when the fab is fully equipped with tools, its cleanroom space will reach 600,000 feet2 (55,700 meters2), which is about two times larger compared to cleanroom space at GlobalFoundries' Fab 8 and which is comparable to cleanroom space at giant fabs operated by Micron's rivals Samsung and SK Hynix is...

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

19 by Dr. Ian Cutress on 1/3/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

Micron Obtains License to Sell DRAM & NAND to Huawei

The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...

12 by Anton Shilov on 12/19/2019

ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP

ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...

15 by Anton Shilov on 12/2/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

8 by Anton Shilov on 10/22/2019

Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel

Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...

14 by Anton Shilov on 10/21/2019

Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI

The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...

38 by Anton Shilov on 10/11/2019

Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit

Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...

12 by Anton Shilov on 9/13/2019

Hot Chips 31 Live Blogs: Facebook Zion Unified Training Platform

Facebook is presenting details on Zion, its next generation in-memory unified training platform.

0 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Analysis: In-Memory Processing by UPMEM

One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...

38 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Intel Optane

This year at Hot Chips, Intel is presenting the latest updates to its Optane PCDMM strategy.

21 by Dr. Ian Cutress on 8/19/2019

Hot Chips 31 Live Blogs: Princeton In-Memory Compute Embedded CPU

Princeton is presenting it's own solution for in-memory compute this year at Hot Chips.

3 by Dr. Ian Cutress on 8/19/2019

Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology

Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...

25 by Anton Shilov on 8/16/2019

SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators

SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...

23 by Ryan Smith on 8/12/2019

Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea

Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...

16 by Anton Shilov on 8/9/2019

Microchip Announces DRAM Controller For OpenCAPI Memory Interface

Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...

17 by Billy Tallis on 8/5/2019

G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000

G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14...

10 by Anton Shilov on 8/1/2019

Thermaltake’s Launches Liquid-Cooled WaterRam RGB DDR4-3600 Kits

Seemingly intent on proving that everything in a PC should in fact be liquid cooled, Thermaltake this week has expanded its WaterRAM lineup of water-cooled RAM with DDR4-3600 kits. Available...

18 by Anton Shilov on 8/1/2019

Corsair Unveils 32 GB Vengeance LPX DDR4 DIMMs, 64 GB & 128 GB Dual-Channel Kits

Corsair has introduced its first 32 GB unbuffered DRAM modules along with 64 GB and 128 GB dual-channel memory kits for mainstream PC platforms based on AMD’s 400/500-series as...

19 by Anton Shilov on 7/19/2019

Patriot Unveils Viper 4 Blackout: Compatible with Ryzen 3000, Up to DDR4-4000

Patriot has expanded its memory offerings for enthusiasts with a brand-new family of products, the Viper 4 Blackout. The new lineup supports data transfer rates of up to 4000...

15 by Anton Shilov on 7/11/2019

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